A UV grooving process is often used as a preliminary step to saw dicing in the semiconductor industry, to prevent sensitive structured from being damaged by shear forces during dicing. In this article we review how diffractive UV beam splitters, also known as multispot DOEs, enable. Semiconductor packaging is a growing application field for UV lasers in general, and especially for ultra short pulsed (USP) UV lasers. It is a crucial part of many optical experimental and measurement systems, such as interferometers, also finding widespread application in fibre optic telecommunications. In its. FOR SPLITTING INTO ONE OR MORE DEFINED PARTIAL BEAMS. When working with lasers, it is often necessary to split a laser beam into two or more defined partial beams. Dielectrically coated beam. In this paper, we describe a 2-stage laser beam-splitting strategy based on both polarization re-fractive and diffractive optics, and its implementation into independent modules. In the first stage, only refractive polarization optics is used and a variable number of sub-beams is produced, each. As a basic and important link in on-chip photon propagation, beam splitting is of great significance for the efficient utilization of sources and the compact integration of optoelectronic devices.