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New Co-packaged Photonics Technology from Paraguay
Highly integrated photonic integrated circuit chips designed for transceiver pluggable and co-packaged optics. Built for power and bandwidth efficient optical connectivity in the AI-scale data center. We report on the successful design and fabrication of optical modules using a 50 micron pitch polymer waveguide interface, integrated for low loss, high density optical data transfer with very low space requirements on a Si photonics die. This prototype module meets JEDEC reliability standards and. Co-Packaged Optics (CPO) is emerging as a critical technology to address AI-driven bandwidth and energy challenges. The emergence of Generative AI has further fueled the demand for high-speed data transfer such that nearly three-fourths of the data center traffic resides within da.
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